新材料科技與化學(xué)技術(shù)創(chuàng)新
電鍍中間體/水性工業(yè)涂料/工業(yè)清洗化學(xué)品
Metallization for Flexible Circuits
2022-03-07 09:53
Enabling high-density flexible boards
DuPont’s longstanding expertise in electroless copper plating is an excellent match for the demands of flexible and rigid-flex circuits built with polyimide. As more applications migrate to flexible boards, DuPont is committed to providing solutions that will enable high performance in any design configuration. Our highly conductive copper metallization is compatible with roll-to-roll processing and low-stress for long-term durability.
Choose DuPont as your materials solutions partner to provide:
- Cost-effective copper plating
- Balanced pH that is suitable for chemically-sensitive polyimide substrates
- Multiple plating options tailored to your specific application
- Meeting Flexible PCB Demands
Metallization Materials for PCBs
- Flexible Circuits
- Multi-Layered Boards
- High Density Interconnect
- IC Substrates
Flexible Circuits
Copper plating to meet the demands of flexible PCBs.
A patented 3-step desmear to effectively clean, condition and activate hole-wall surfaces.
A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications
Processes especially designed for operation in vertical and horizontal equipment respectively
Producing uniform crystal grain structure to provide a smooth plated surface on rolled copper
A copper plating process producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.
Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance
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垂直連續(xù)電鍍（VCP）高TP值酸性鍍銅光澤劑用電鍍中間體：www.phone3g.cn/news/170.html
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2021年度填孔鍍銅——印刷線路板（PCB，F(xiàn)PC）酸性填孔鍍銅中間體：www.phone3g.cn/news/283.html
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深圳市同泰化學(xué)技術(shù)有限公司參加了2021年7月26-28日在廣州保利世貿(mào)博覽館舉辦的第十四屆廣州國際表面處理、電鍍、涂裝展覽會，誠邀您蒞臨同泰化學(xué)電子展廳參觀指導(dǎo)！電子展廳鏈接：www.phone3g.cn/news/316.html。
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